Qualcomm Announces Fifth Generation Embedded Data Connectivity Reference Platform

Qualcomm Incorporated (NASDAQ: QCOM) today announced its fifth generation Gobi™ embedded data connectivity reference platform for mobile devices, including thin form factor laptops, tablets and convertibles. Based on Qualcomm’s Gobi 4G LTE wireless baseband modems, the MDM9615™ and MDM9215™, the technology delivers fast LTE connectivity on FDD and TDD networks worldwide, with backwards compatibility to both HSPA+ and EV-DO networks. This will allow support for regional LTE frequencies with backwards compatibility to existing 2G/3G technologies, allowing Gobi 4G LTE devices to connect to the faster LTE network locally and stay connected to the Internet globally on 3G networks worldwide. The reference platform will support leading operating systems, such as Windows 8 and Android, with a broadband interface with carrier selection. It is also designed to support these leading operating systems on multiple processing platforms, including our Snapdragon™ dual-core and quad-core processors and x86 platforms.

Embedded modules based on the Gobi fifth generation reference platform will initially be available from Huawei, Novatel Wireless, Option, Sierra Wireless and ZTE in several form factors and regional configurations, making them a compelling 4G LTE solution for a variety of connected mobile devices.

“Mobile computing and broadband connectivity have already become indispensable tools in the road warrior’s arsenal,” said Fram Akiki, senior director of product management for Qualcomm CDMA Technologies. “With Windows 8, we expect to see an increasing variety of mobile computing devices also in use by connected consumers around the world. Our Gobi fifth generation reference platform helps ensure that OEMs can develop products across their choice of operating systems and hardware platforms to meet the growing demand for mobile connectivity.”

Qualcomm’s latest Gobi 4G LTE connectivity reference platform includes embedded GPS capability and features an application programming interface (API) with LTE extensions, which is compatible with leading connectivity standards, including CDMA2000® 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+, TD-SCDMA and LTE, with integrated backwards compatibility to HSPA and EV-DO. The API provides a common software interface for developing connection managers, GPS applications and other manageability or security solutions that help connect, locate and manage a broad range of 3G/4G devices, regardless of wireless technology and operating system. This interface will help streamline product development efforts, spur application development among third-party software developers, and deliver greater flexibility to device manufacturers.

“As one of the most widely used business PCs in the world, Dell Latitude brand laptops need to support a broad range of technology so our customers can connect virtually anywhere and at any time, and Qualcomm’s Gobi platform helps us achieve this,” said Kirk Schell, executive director and general manager of Dell’s Business Client Product Group. “As mobile broadband technologies evolve, Qualcomm’s Gobi technology is an option our customers frequently select to stay connected no matter what kind of network they are on thanks to its multi-mode capabilities.”

“Qualcomm’s Gobi platform has proven to be a compelling wireless solution for embedded mobile broadband connectivity, adding to the performance, security and reliability of our ThinkPad laptops,” said Dilip Bhatia, vice president and general manager, ThinkPad, Lenovo. “We look forward to giving our customers an even faster mobile Internet experience with Gobi 4G LTE technology.”

“Huawei’s mobile broadband modules and data cards are used by OEMs and consumers worldwide, so support for multi-mode operation is a key feature of our products,” said He Jinjun, director of Device Module Business, Huawei. “Qualcomm’s fifth generation Gobi reference platform will give our LTE devices the multi-mode support they need to remain connected virtually anywhere.”

“Our Expedite Module portfolio contains multiple products offering LTE support based on Qualcomm’s Gobi technology,” said Rob Hadley, chief marketing officer, Novatel Wireless. “We look forward to offering our OEM customers new embedded modules using next-generation technology targeting devices such as notebooks, netbooks and tablets.

“At Option, we have a long standing relationship with Qualcomm in providing innovative 3G, 4G LTE and WLAN connectivity solutions with enhanced performance, functionality and usability,” said Bernard Schaballie, general manager, embedded solutions, Option. “Qualcomm’s Gobi technology has been a key enabler and we look forward to using its fifth generation Gobi reference platform in our new GTM801 LGA module family.”

“Sierra Wireless has offered wireless modules with LTE support since 2010, and Qualcomm Gobi technology has been important to the success of our LTE module program,” said Dan Schieler, senior vice president and general manager, Mobile Computing for Sierra Wireless. “Our LTE modules give OEMs the ability to embed support for the latest mobile broadband technology in a variety of connected devices, and the fifth generation Gobi reference platform will help ensure these connections provide a fast, consistent user experience.”

“Qualcomm’s Gobi technology has been used in many of our mobile broadband USB modems and mobile hotspots for some time now,” said Dr. Liu ShuLiang, data product planning director, ZTE. “LTE will give mobile consumers the fast data rates and reliable connections they need to make their mobile computing experience a productive one. We look forward to delivering fast LTE USB modems based on the Gobi technology.”

As one of the largest providers of wireless chipset and software technology in the industry, Qualcomm has a diverse chipset and software product portfolio spanning multiple device classes. System designers now have the flexibility to choose from multiple embedded Gobi solutions, ranging from 3G through high-speed, multi-operator 4G LTE. Qualcomm also offers its family of Snapdragon all-in-one processors with the option for integrated multimode 3G/4G, dual-band Wi-Fi®, Bluetooth, FM radio connectivity and differing numbers of CPU cores for the most power-efficient designs.

“We have all become used to accessing every song ever made, every book ever written, every movie in every genre through cloud-based services. Gaikai is bringing this same functionality to video games and other interactive software,” stated Perry. Gaikai started in 2009 and has 65 employees.

[VentureBeat]

Microsoft Announces Support of System on a Chip Architectures From Intel, AMD, and ARM for Next Version of Windows

LAS VEGAS — Jan. 5, 2011 — Microsoft Corp. today announced at 2011 International CES that the next version of Windows will support System on a Chip (SoC) architectures, including ARM-based systems from partners NVIDIA Corp., Qualcomm Inc. and Texas Instruments Inc. On the x86 architecture, Intel Corporation and AMD continue their work on low-power SoC designs that fully support Windows, including support for native x86 applications. SoC architectures will fuel significant innovation across the hardware spectrum when coupled with the depth and breadth of the Windows platform.

At today’s announcement, Microsoft demonstrated the next version of Windows running on new SoC platforms from Intel running on x86 architecture and from NVIDIA, Qualcomm and Texas Instruments on ARM architecture. The technology demonstration included Windows client support across a range of scenarios, such as hardware-accelerated graphics and media playback, hardware-accelerated Web browsing with the latest Microsoft Internet Explorer, USB device support, printing and other features customers have come to expect from their computing experience. Microsoft Office running natively on ARM also was shown as a demonstration of the full depth and breadth of Windows platform capabilities on ARM architecture.

Windows will continue its industry-leading support across the widest possible set of devices, delivering the breadth and choice that customers demand. Intel and AMD continue to evolve and improve the x86 platforms, including new low-power systems, and advance new designs such as the recently announced 2nd Generation Intel® Core™ processor family and AMD’s Fusion accelerated processing units (APUs). NVIDIA, Qualcomm and Texas Instruments are joining Microsoft to provide ARM-based designs for the first time.

“With today’s announcement, we’re showing the flexibility and resiliency of Windows through the power of software and a commitment to world-class engineering. We continue to evolve Windows to deliver the functionality customers demand across the widest variety of hardware platforms and form factors,” said Steven Sinofsky, president of the Windows and Windows Live Division at Microsoft.

SoC architectures consolidate the major components of a computing device onto a single package of silicon. This consolidation enables smaller, thinner devices while reducing the amount of power required for the device, increasing battery life and making possible always-on and always-connected functionality. With support of SoC in the next version of the Windows client, Microsoft is enabling industry partners to design and deliver the widest range of hardware ever.

Founded in 1975, Microsoft (Nasdaq “MSFT”) is the worldwide leader in software, services and solutions that help people and businesses realize their full potential.

Silicon Partner Quotes

AMD

“We are entering a new era of computing where HD content and 3-D user interfaces are commonplace, from high-end gaming and content creation to video playback and Web browsing. Together, AMD and Microsoft enable these vivid and engaging PC experiences on x86-based devices, ranging from high-resolution, multidisplay desktops to ultrathin notebooks, netbooks and tablets, and we look forward to a new wave of innovation made possible by Windows and AMD Fusion APUs. Windows and AMD Fusion APUs bring to life outstanding Internet experiences, smooth video playback of HD and 3-D content, and acceleration of popular productivity applications.”

Manju Hegde
Corporate Vice President, Fusion Experience Program
AMD (NYSE: AMD)

ARM Holdings plc

“We are excited by today’s announcement, which marks a significant milestone for ARM and the ARM Partnership, and we look forward to working with Microsoft on the next generation of Windows. Windows combined with the scalability of the low-power ARM architecture, the market expertise of ARM silicon partners and the extensive SoC talent within the broad ARM ecosystem will enable innovative platforms to realize the future of computing, ultimately creating new market opportunities and delivering compelling products to consumers.”

Warren East
CEO
ARM

Intel Corporation

“Even conservative predictions show billions of devices coming online in the next few years. One need only look at the creation and rapid growth of the netbook category to grasp what an Intel and Microsoft combination can deliver. While still in the future, what is so exciting is how our two companies will be able to match a tailored, low-powered Windows operating system with future generations of our popular Intel® Atom™ processors to deliver unique, PC-like experiences that offer the best battery life, performance and security around.”

Douglas L. Davis
Vice President, General Manager, Netbook and Tablet Group
Intel

NVIDIA Corp.

“Windows on ARM represents a seismic shift for the computing industry. ARM is already the largest and fastest-growing CPU architecture in the world, and today’s major news of Windows will only accelerate its adoption. We look forward to working with Microsoft to create amazing new computing devices with Windows.”

Jen-Hsun Huang
President and Chief Executive Officer
NVIDIA

Qualcomm Inc.

“Today signals a significant step forward for the future of computing. We at Qualcomm are excited about continuing our relationship with Microsoft to extend the reach of Windows to more Snapdragon-powered devices, offering high-performance mobile solutions with always-on connectivity.”

Rob Chandhok
President, Qualcomm Internet Services
President, Qualcomm Innovation Center Inc.

Texas Instruments (TI)

“Texas Instruments (TI) is pleased to collaborate with Microsoft to make Windows on mobile devices a reality. TI has long believed that low power is the fundamental of fundamentals when it comes to mobility, and we look forward to taking our popular OMAP™ platform, with the ideal balance of high performance and low power, into exciting new mobile computing devices.”

Remi El-Ouazzane
Vice President and General Manager, OMAP Platform Business Unit
TI