AMD announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.
The company said the investments are designed to support growing demand for AI infrastructure by advancing silicon, packaging, and manufacturing technologies that improve performance, efficiency, and deployment speed for AI systems. AMD is working with strategic partners in Taiwan and globally to enhance chiplet architectures, high bandwidth memory integration, 3D hybrid bonding, and rack-scale system design.
AMD also highlighted its work on EFB-based 2.5D packaging technology, which is being developed with Taiwan-based ASE and SPIL alongside other industry partners. The EFB architecture is intended to increase interconnect bandwidth and improve power efficiency for 6th Gen AMD EPYC CPUs, codenamed “Venice.” AMD said these improvements will help customers deploy faster and more efficient AI systems while staying within real-world power and cooling constraints.
In addition, AMD announced a milestone with PTI, qualifying what it described as the industry’s first 2.5D panel-based EFB interconnect technology. The company said the technology enables high-bandwidth interconnect at scale while improving the economics of deploying AI systems.
AMD stated that these innovations will support the deployment of the AMD Helios rack-scale platform beginning in the second half of 2026. The Helios platform will feature AMD Instinct MI450X GPUs, 6th Gen AMD EPYC CPUs, advanced networking technologies, and the AMD ROCm open software stack.
The company added that manufacturing and deployment efforts for the Helios platform are being supported by ODM partners, including Sanmina, Wiwynn, Wistron, and Inventec. AMD said the platform is designed to deliver advances in compute, interconnect bandwidth, memory capacity, and system level integration to support increasingly complex AI workloads.
KEY QUOTES:
“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.”
Dr. Lisa Su, Chair and CEO, AMD
“Sanmina is proud to partner with AMD to deliver next-generation AI infrastructure at scale. Our work together on AMD Helios manufacturing highlights the strength of the ecosystem and our shared commitment to delivering high-performance, reliable solutions to customers worldwide.”
Jure Sola, Chairman and CEO, Sanmina Corporation
“Wiwynn’s collaboration with AMD on the Helios platform reflects our commitment to delivering fully integrated, rack-scale AI infrastructure. Together, we are empowering hyperscalers to deploy AI at scale with the performance, efficiency and reliability the market demands.”
William Lin, President and CEO, Wiwynn
“Inventec is pleased to collaborate with AMD on delivering high-performance AI and data center systems. Together, we are enabling customers to deploy powerful, energy-efficient infrastructure to support increasingly complex workloads.”
Jack Tsai, President, Inventec
“Our collaboration with AMD on Elevated Fanout Bridge technology represents a significant step forward in scaling advanced packaging for high-volume applications. By working together to industrialize EFB, we are enabling greater performance, efficiency and flexibility for next-generation data center platforms.”
Steven Tsai, Senior Vice President, Sales, ASE
“SPIL is proud to partner with AMD to bring innovative packaging solutions like EFB to market. These technologies are helping expand the reach of advanced packaging into new applications while supporting the rapid growth of AI infrastructure.”
John Yu, Vice President, Sales, SPIL
“Through our work with AMD on panel-based EFB, we are delivering new levels of scalability and cost efficiency for advanced packaging. This collaboration enables faster time-to-market and supports the high-volume production requirements of next-generation processors like ‘Venice.’”
DK Tsai, Chairman, PTI
“Unimicron is pleased to support AMD with advanced substrate solutions as packaging requirements become increasingly complex for high-performance computing.”
Kevin Chen, President of Substrate BU, Unimicron Technology Corp.
“AIC is proud to work closely with AMD on the Helios program, supporting the mechanical architecture that helps bring this advanced AI infrastructure platform to life. Our collaboration across rack-level and compute tray design reflects the strength of our partnership with AMD and our shared commitment to delivering scalable, high-performance solutions for the next generation of AI.”
Michael Liang, Chairman, AIC
“Nan Ya PCB values its collaboration with AMD and is committed to supporting advanced packaging growth through high-quality substrate technology, manufacturing excellence and resilient supply chain execution.”
Jack Lu, President, Nan Ya PCB
“Kinsus is proud to support AMD’s advanced packaging growth with high-quality substrate technology and trusted supply chain collaboration.”
Scott Chen, President, Kinsus
