Samsung Electronics and Advanced Micro Devices announced the signing of a memorandum of understanding to expand their strategic collaboration on next-generation AI memory and computing technologies. The agreement focuses on advancing high-bandwidth memory and next-generation DRAM solutions to support increasingly complex AI workloads and data center infrastructure.
Under the agreement, Samsung will serve as a primary supplier of its next-generation HBM4 memory for AMD’s upcoming Instinct MI455X AI accelerators. The collaboration also includes joint development of advanced DDR5 memory solutions optimized for AMD’s sixth-generation EPYC processors, codenamed “Venice,” as well as support for AMD’s Helios rack-scale platform.
The companies are working together to address growing demands for higher memory bandwidth and improved power efficiency in AI systems. Samsung’s HBM4 technology is built on its sixth-generation 10-nanometer-class DRAM process and a 4-nanometer logic base die, delivering speeds of up to 13 gigabits per second and bandwidth of up to 3.3 terabytes per second.
AMD’s Instinct MI455X GPU, powered by Samsung’s HBM4 memory, is expected to play a key role in high-performance AI systems for model training and inference. The GPU will also serve as a core component of AMD’s Helios architecture, designed to scale AI infrastructure at the rack level.
The collaboration may extend further into foundry services, with Samsung potentially manufacturing future AMD products. The partnership builds on nearly two decades of collaboration between the companies across graphics, mobile, and computing technologies, including Samsung’s role as a primary HBM3E supplier for AMD’s current AI accelerators.
KEY QUOTES:
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration. From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”
Young Hyun Jun, Vice Chairman & CEO, Samsung Electronics
“Powering the next generation of AI infrastructure requires deep collaboration across the industry. We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”
Dr. Lisa Su, Chair and CEO, AMD
