Amkor Technology announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity, part of a $1.5 billion multi-year advanced packaging and development agreement.
NVIDIA and Amkor will align their long-term technology roadmaps to advance high-density interconnects and next-generation heterogeneous integration. Amkor has already supplied advanced packaging solutions supporting NVIDIA’s data center processors, networking chipsets, and accelerated computing systems, and the expanded collaboration is intended to bring new packaging technologies to market as demand for AI infrastructure grows. NVIDIA’s capacity agreement supports the expansion of Amkor’s U.S. operations in Arizona, complementing the company’s existing manufacturing footprint across Asia.
KEY QUOTES:
“AI is driving a generational shift in technology, transforming every industry and creating a unique opportunity to reinvigorate American manufacturing and supply chains. Amkor’s global capabilities, combined with their committed investment in the United States, are critical components of building resilient AI infrastructure and accelerating next-generation technologies.”
Debora Shoquist, Executive Vice President of Operations, NVIDIA
“This strategic partnership with NVIDIA underscores the central role advanced packaging plays in enabling the future of AI. Our agreement with NVIDIA accelerates our long-term roadmap and supports our ability to deliver full turnkey advanced packaging and test solutions, leveraging our global footprint while expanding U.S. capabilities to support critical AI infrastructure.”
Kevin Engel, Chief Executive Officer, Amkor Technology
