Amkor Technology is moving forward with Phase 2 of its Arizona advanced packaging and test campus, increasing its planned investment to about $12 billion.
The expansion follows customer commitments that have surpassed the 33,000 square meters of cleanroom capacity originally planned for Phase 1.
Phase 2 is expected to add another 60,000 square meters, bringing total cleanroom space at the Arizona campus to approximately 93,000 square meters.
The facility is being developed as a multi-phase semiconductor manufacturing project supporting wafer bump, probe, assembly, and test services.
Together, Phase 1 and Phase 2 are expected to support more than 3,500 Arizona-based employees.
Amkor said its Arizona campus will be the first U.S. outsourced semiconductor assembly and test production site for advanced packaging in high volume, providing customers with a domestic turnkey manufacturing platform.
Construction of Phase 2 is expected to begin in late 2027, with completion targeted by the end of 2029.
The campus covers approximately 170 acres, providing room for additional expansion as customer demand develops.
Amkor’s advanced packaging capabilities serve semiconductor applications spanning smartphones, data centers, artificial intelligence, automobiles and wearable devices.
KEY QUOTE:
“This next phase reflects the confidence our customers have placed in Amkor, the critical role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic importance of our Arizona campus. As chip architectures become more complex, customers need a trusted partner that can deliver at scale with the quality, technology leadership and operational discipline required for their most advanced products, and it is critical to have that capacity in the U.S.”
Kevin Engel, President and CEO of Amkor Technology
