Earlier this week, Ansys made a couple of notable announcements, including Ansys and Altium boosting their designs with digital continuity and Intel Foundry Services certified Ansys multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 16 silicon manufacturing process.
Ansys and Altium Boosting Electronics Design With Digital Continuity
Altium and Ansys are partnering to improve the electronic design and development process by digitally connecting Altium’s electronic computer-aided design (ECAD) tools and Ansys Electronics Desktop. This bidirectional integration, set to be available in the second half of 2023, creates a new level of digital continuity while helping to reduce development time and the risk of design errors.
This connection will facilitate seamless collaboration, streamlining design data exchange and enabling engineers to work together more effectively within a fully integrated workflow. And by eliminating the need for import/export translations and replacing manual, ad-hoc communication methods, the integration supports predictive accuracy, synchronization, and productivity, while reducing the risk of errors. So the digital bridge also minimizes the potential for respins and delays.
This is a seamless connection between Altium ECAD and Ansys simulation software – which transforms electronics development (Photo Credit: ANSYS)
Printed circuit boards (PCBs) are integral to electronic devices spanning various industries and applications like automotive, consumer electronics, Internet of Things (IoT), and more. And as connectivity advances from wearable technology to autonomous vehicles, electronics designs increasingly involve fragile components like sensors and integrated circuits (ICs). Consequently, predictively accurate modeling and simulation become crucial for design success.
The comprehensive electronic design requires an evaluation of signal and power integrity, electromagnetic compatibility, thermal mechanical stresses, and electronics reliability. And Ansys offers end-to-end simulation solutions for PCBs, ICs, and IC packages to evaluate an entire system.
Signoff Verification For Intel 16 Process Node
Intel Foundry Services (IFS) certified Ansys multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 16 silicon manufacturing process. And the predictive accuracy of Ansys’ power integrity and signal integrity platforms help designers increase the performance of edge AI, graphic processing, and wireless communication products by avoiding wasteful over-design. This collaboration with IFS validated a seamless electronic design automation (EDA) flow that delivers high productivity for joint customers.
Ansys RedHawk-SC and Ansys Totem have been recognized as industry standards for power integrity signoff of digital and analog designs. And the solutions’ cloud-enabled data infrastructure provides unparalleled capacity to analyze full-chip designs, hierarchically or flat. And Ansys PathFinder-SC utilizes the same elastic compute infrastructure to verify the electrostatic discharge (ESD) protection circuitry found on all chips.
Ansys Redhawk-SC, Ansys Totem, and Ansys PathFinder-SC (pictured) support power integrity, signal integrity, and reliability signoff requirements for the Intel 16 process node (Photo credit: Ansys)
Key Quotes About Altium Partnership
“As companies innovate to meet the demand of today’s competitive landscape, they face new product complexities and engineering challenges that require extensive cross-domain collaboration and advanced simulations. And the outdated, manual integration methods being utilized are holding them back. This digital connection between ECAD and simulation enables electrical engineers and simulation engineers to work together with ease and accuracy, helping companies to accelerate design time and minimize additional costs.”
— Tomek Brzuchacz, head of CAD software at Altium
“Electronics designers and engineers work tirelessly to produce the countless connected devices and applications demanded by today’s market, and it is critical to equip these innovators with the same level of connectivity during design and development. With a bidirectional link between Ansys and Altium solutions, electrical engineers will no longer be slowed down or interrupted by data communication and can focus on design, innovation, and collaboration.”
— John Lee, vice president of the electronics, semiconductor, at optics business unit at Ansys
Key Quotes About Signoff Verification for Intel 16 Process Node:
“Ansys and IFS, with a history of close collaboration, are pleased with the broad support of our Intel 16 process including our RF capabilities. We believe in providing our foundry customers with the widest possible array of industry-leading EDA tools that work in their existing design platforms and that make optimal use of our advanced manufacturing technology.”
— Rahul Goyal, vice president & general manager for Intel’s Product & Design Ecosystem Enablement group
“Ansys works with leading foundry partners like Intel Foundry Services to address complex multiphysics challenges and meet stringent power, performance, and reliability requirements. Ansys’ signoff platform helps empower mutual customers to accelerate design convergence with greater confidence thanks to the collaborative work between the companies to ensure silicon predictive accuracy and a smooth user experience.”
— John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys
