Apple has signed a new multiyear agreement with Broadcom to design and produce custom silicon components and advanced wireless connectivity technologies for a wide range of Apple products, in a deal expected to exceed $30 billion. The commitment, announced from Cupertino, will lead to the production of more than 15 billion chips manufactured in the United States and support hundreds of American jobs, as Apple works with the administration and domestic suppliers to build an end‑to‑end silicon supply chain in the U.S.
Broadcom is a key participant in Apple’s American Manufacturing Program (AMP), launched in 2025 to accelerate domestic manufacturing as part of Apple’s broader pledge to invest $600 billion in the U.S. economy over four years. This new agreement is Apple’s largest AMP commitment to date and will enable Broadcom to expand and modernize its Fort Collins, Colorado manufacturing facilities with a $1.5 billion capital expenditure. At that site, Broadcom will produce advanced radio‑frequency components — including FBAR filters — and cutting‑edge wireless connectivity technologies that power Apple devices.
Apple frames the deal as both an industrial policy move and a product‑level bet. CEO Tim Cook said the partnership “further accelerates” Apple’s commitment to American manufacturing and innovation, and stressed that the components built in Fort Collins are essential to delivering the performance and connectivity customers expect from iPhone and other devices. Apple highlighted its intention to deepen investments in U.S.-based suppliers that share its focus on excellence and innovation and publicly thanked the president and his administration for supporting projects like the Broadcom expansion.
Broadcom, for its part, describes the agreement as an extension of decades of collaboration with Apple and says it shares Apple’s commitment to American innovation. CEO Hock Tan emphasized that, with Apple’s newest commitment, Broadcom will expand its manufacturing footprint in Fort Collins, where it produces technology that connects people around the world. Analysts note that while the deal is structured as a long‑term purchasing agreement rather than direct equity investment, it effectively underwrites Broadcom’s U.S. RF manufacturing roadmap and cements the chipmaker’s role as a key supplier of components Apple cannot yet economically replace with in‑house designs.
The Broadcom agreement is one pillar of Apple’s $600 billion U.S. investment plan, which spans manufacturing, job creation and technology development. That pledge includes the American Manufacturing Program, direct hiring of tens of thousands of U.S. employees focused on R&D and silicon engineering, and incentives for global suppliers to expand domestic production of materials and components used in Apple’s products.
KEY QUOTES:
“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation. The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to deepen our investments in U.S.-based suppliers that share our commitment to excellence and innovation. We’re grateful to the president and his administration for supporting important projects like this one.”
Tim Cook, CEO, Apple
“Broadcom is proud to continue to work with Apple after decades of success together, and we share a strong commitment to American innovation. With Apple’s newest commitment, we’re pleased to expand our manufacturing footprint in Fort Collins, where we create groundbreaking technology that connects people around the world.”
Hock Tan, President and CEO, Broadcom
