Applied Materials announced a long-term research and development partnership with SK hynix to accelerate innovation in next-generation memory technologies used in artificial intelligence and high-performance computing. Under the agreement, engineers from both companies will collaborate at Applied Materials’ new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley. The facility is designed to help semiconductor companies develop and commercialize advanced technologies faster by enabling closer collaboration between equipment makers and chip manufacturers.
The partnership will focus on advancing next-generation DRAM and high-bandwidth memory (HBM), which are critical for powering AI systems and data-intensive workloads. The collaboration will explore new materials, complex integration schemes, and advanced packaging technologies designed to improve the performance, efficiency, and manufacturability of future memory architectures.
Applied Materials said the EPIC Center represents the largest U.S. investment in advanced semiconductor equipment research and development, with capital spending expected to scale to approximately $5 billion as customer projects begin.
As part of the collaboration, SK hynix engineers will work alongside Applied Materials technologists at the EPIC Center to accelerate the development of new materials and manufacturing approaches. The partnership will also leverage Applied’s advanced packaging research capabilities in Singapore to connect device-level innovations with heterogeneous integration and next-generation 3D packaging.
The companies said the joint effort is aimed at addressing long-term semiconductor R&D challenges as AI workloads drive increasing demand for faster and more energy-efficient memory systems.
Applied Materials said the EPIC Center is designed to provide chipmakers earlier access to its research portfolio, enabling faster learning cycles and accelerating the transition of new technologies from early-stage research into high-volume manufacturing.
KEY QUOTES:
“Applied Materials and SK hynix share a long history of working together to improve the energy-efficient performance of advanced memory chips through innovations in materials engineering. We are excited to have SK hynix join the EPIC Center as a founding partner, and we look forward to driving further breakthroughs together that accelerate commercialization of next-generation DRAM and HBM technologies for the AI era.”
Gary Dickerson, President And CEO Of Applied Materials
“Continued progress in memory increasingly relies on materials engineering innovations across both the device and packaging level. By combining the power of the EPIC Center in Silicon Valley with Applied’s advanced packaging capabilities in Singapore, our collaboration with SK hynix will enable us to co-optimize the entire technology stack and accelerate the path to manufacturable memory innovations.”
Dr. Prabu Raja, President Of The Semiconductor Products Group At Applied Materials
“The continued scaling of AI systems is driving unprecedented demand for energy-efficient memory technologies. One of the biggest hurdles in AI progress is the growing disconnect between memory speeds and advances in processors. Our advanced memory technologies are paving the way for faster and more energy-efficient data processing, and we look forward to partnering with Applied Materials at the new EPIC Center to deliver a roadmap of innovations that enable the next generation of memory solutions optimized for AI.”
Nohjung Kwak, President And CEO Of SK hynix
“Advancing memory technology for the AI era requires new approaches to developing wafer fab equipment. Our co-innovation programs with Applied Materials will focus on new materials, integration approaches and thermal-management technologies spanning device engineering and advanced packaging. Working alongside Applied engineers at the EPIC Center gives our teams faster learning cycles and manufacturing-relevant validation for next-generation AI memories.”
Seon Yong Cha, Chief Technology Officer Of SK hynix
