Credo Technology Group Holding announced the completion of its acquisition of DustPhotonics, adding silicon photonics photonic integrated circuit (SiPho PIC) technology to its optical connectivity portfolio and strengthening its position in the rapidly growing AI infrastructure market.
The acquisition expands Credo’s optical interconnect offerings across 800G, 1.6T, and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO). By integrating DustPhotonics’ silicon photonics technology, Credo now offers a vertically integrated connectivity stack that spans SerDes, digital signal processing (DSP), silicon photonics, and system integration. The combined platform is designed to address both electrical and optical interconnect requirements for scale-out and scale-up AI networks.
The company said the addition of DustPhotonics enhances its ability to support next-generation AI infrastructure, where increasing bandwidth, power efficiency, and scalability are critical requirements.
Credo expects its combined portfolio of ZeroFlap optical transceivers, optical DSPs, and silicon photonics products to become a significant growth driver in fiscal 2027. The company cited strong customer demand and growing adoption among hyperscale AI deployments as key factors supporting its outlook.
Bill Brennan, President and CEO of Credo, said the transaction brings together two organizations with complementary expertise and a shared focus on innovation and customer success. He noted that the combined company will continue developing end-to-end optical connectivity solutions focused on reliability and power efficiency to help customers scale AI infrastructure.
Ronnen Lovinger, who now serves as Vice President of Silicon Photonics at Credo, highlighted the importance of silicon photonics in enabling future AI networking architectures. He said the technology is expected to play a foundational role in delivering the bandwidth, efficiency, and scale required by next-generation AI-driven infrastructure.
Credo develops high-speed copper and optical interconnect products designed for large-scale data infrastructure environments. Its portfolio includes ZeroFlap Active Electrical Cables (AECs), optical transceivers, OmniConnect memory solutions, retimers, DSPs, and the PILOT diagnostic and analytics software platform.
KEY QUOTES:
“I am thrilled to officially welcome the talented team from DustPhotonics to Credo. Today marks an important milestone as we join two deeply skilled organizations united by a shared commitment to innovation, execution, and customer impact. Together, we will continue to advance a powerful, end-to-end optical connectivity solution platform with reliability and power efficiency at its core, helping our customers scale AI infrastructure.”
Bill Brennan, President And CEO, Credo
“Today we celebrate that DustPhotonics is now a part of Credo. I am extremely proud of the silicon photonics advancements we pioneered as a team, and am excited to work alongside our new colleagues to accelerate our vision for optical interconnect. Silicon photonics will increasingly become the foundational technology for AI-driven optical connectivity—enabling the bandwidth, efficiency, and scale that next-generation infrastructure demands.”
Ronnen Lovinger, Vice President, Silicon Photonics, Credo
