Eliyan Corporation has completed its Series C with a total of $145 million at a $1 billion valuation. Seligman Ventures led the round, with participation from new strategic investors Cisco Investments and Lumentum.
Eliyan’s Die-to-Die, Chip-to-Chip, and Rack-to-Rack chiplet interconnect technologies address connectivity demands of next-generation AI systems. The company’s NuLink PHYs and NuGear chiplet families provide scalable connectivity solutions addressing I/O, memory, and power constraints in AI scale-up and scale-in networks.
Umesh Padval, Managing Partner of Seligman Ventures, will join Eliyan’s Board of Directors. The financing will expand Eliyan’s development of next-generation interconnect technologies, ecosystem partnerships, and manufacturing.
KEY QUOTES:
“AI infrastructure is undergoing one of the largest architectural transitions in computing history. As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level.”
Ramin Farjadrad, CEO and Co-Founder, Eliyan
“We are thrilled to partner with repeat founders Ramin, Patrick, and Syrus as they build a leader in high-speed interconnect technology for AI infrastructure. As AI systems continue to scale, efficient electrical and optical interconnects that enable future scale-up and scale-out networks between compute and memory are becoming the performance-defining technologies of modern AI data centers.”
Umesh Padval, Managing Partner, Seligman Ventures
