EPIC Microsystems, a semiconductor company focused on advanced power delivery solutions for AI infrastructure, announced it has raised $21 million in Series A funding to accelerate the development of its vertical power delivery architecture for next-generation data centers. The round was led by Seligman Ventures, with participation from Intel Capital, AICONIC Ventures, Cambium Capital, and existing investors including A&E Investments, Assam Ventures, and Nepenthe Capital. With this latest financing, the company has raised a total of $26 million to date.
The funding comes as AI workloads drive unprecedented power demands in data centers, with rack densities approaching one megawatt. Traditional power delivery systems are increasingly strained by limitations in efficiency, thermal management, and physical integration, forcing hyperscalers to make trade-offs in performance and cost.
EPIC Microsystems is addressing these constraints with a hybrid switched-capacitor architecture that improves efficiency, increases current density, and enhances thermal performance. Its approach replaces bulky inductors with a combination of capacitors and optimized components, enabling a more compact, low-profile solution that supports modern AI accelerators and GPUs while improving heat dissipation and overall system performance.
The company’s technology is intended to give hyperscalers greater flexibility as AI infrastructure scales toward multi-megawatt environments, where power delivery is becoming as critical as compute performance itself.
As part of the investment, Umesh Padval, Managing Partner at Seligman Ventures, has joined EPIC Microsystems’ Board of Directors.
EPIC Microsystems was founded by a team of semiconductor industry veterans with deep power design experience. Prior to launching the company, the team developed switched-capacitor solutions used in mobile devices, enabling fast charging across hundreds of millions of smartphones and laptops. The company is now applying that expertise to the rapidly growing AI data center market.
KEY QUOTES:
“Power density, efficiency and thermal management have become primary bottlenecks in scaling AI data center infrastructure. EPIC’s technical team brings deep expertise in switched-capacitor innovation and a clear understanding of data center requirements. We believe their vertical power delivery architecture is well positioned to address the next generation of AI system demands.”
Umesh Padval, Managing Partner at Seligman Ventures
“AI data center architectures are breaking historic power boundaries, and existing power delivery ecosystems simply can’t keep up. Our approach reimagines DC-DC power delivery from the ground up. By addressing efficiency, thermals, and rack densification simultaneously, we give hyperscalers greater architectural flexibility as rack power scales toward the multi-megawatt era. I am very excited that an experienced investor and semiconductor industry veteran like Umesh has joined the Board of Directors to help us capitalize on the unprecedented opportunity that is in front of us.”
Sabin Eftimie, Co-Founder and CEO of EPIC Microsystems
“The AI compute roadmap is being defined as much by power delivery innovation as by advances in AI compute silicon.”
Lip-Bu Tan, CEO of Intel
“As workloads scale and infrastructure densifies, the industry must rethink foundational system architectures. Breakthroughs in how power is delivered and managed will be essential to unlocking the next decade of AI performance. EPIC Microsystems is addressing a critical layer of that challenge.”
Andrew Tan, Board Member of EPIC Microsystems and Managing Director at A&E Investments and Salience Capital
