Frore Systems has announced Series C fundraising of $80 million, bringing the company’s total to $196 million. This funding round will be used to scale operations and expand the product line to meet the rapidly growing demand for AirJet Solid-State Active Cooling solutions, which are unleashing the performance of both Edge AI and Data Center AI platforms.
Fidelity Management & Research Company led the Series C funding round. Prosperity7 also made a significant investment in the round, along with all existing investors: Mayfield Fund, Clear Ventures, Addition, Qualcomm Ventures, MVP Ventures, Stepstone Group, Alumni Ventures, and others. This support also reinforces that Frore Systems, the pioneer in solid-state active cooling, is uniquely positioned to seize the massive opportunity in thermal solutions created by the AI revolution.
Frore Systems’ solid-state active cooling chip AirJet is unleashing performance across a wide range of AI platforms:
1.) Edge AI Gateways at the network’s edge to enable faster decision-making without relying solely on the cloud.
2.) On-Device Edge AI, including Copilot+ PCs, which enables AI workloads to be run entirely On-Device to maximize privacy, real-time responsiveness, and energy savings.
3.) Data Center AI factories facilitate higher compute densities for reduced infrastructure, energy, and environmental costs.
Applications utilizing AI generate far more heat than today’s devices are designed to handle. And AirJet can be integrated into the vast number of devices adopting the latest AI capabilities, ensuring these platforms remain cool and are not forced to throttle performance due to heat. The need for improved cooling to enable AI is increasing rapidly, and with demand for AI Computing estimated to increase by over 300% by 2030, it will not slow down anytime soon.
Heat is now the single biggest problem facing the computing industry. AirJet’s ability to dissipate heat, unleashing performance, is essential for AI applications. Frore Systems will be demonstrating their latest AI cooling solutions at COMPUTEX in June 2024, showcasing how AirJet cools up to 100 TOPS of AI workload running on NVIDIA Jetson Orin system-on-modules in thin, silent, dustproof, and vibration-free form factors.
KEY QUOTES:
“Heat is by far the biggest hurdle we need to overcome in computing, and to meet the massive performance increase needed for intense AI workloads. Thermally stressed hardware doesn’t perform optimally, and current thermal solutions fall short. Frore Systems has reinvented thermal technology with its AirJet chip that doubles active heat removal with a thinner, lighter, silent, dustproof, and vibration free solution that provides greater performance.”
– Patrick Moorhead, Industry expert and CEO and Chief Analyst at Moor Insights & Strategy
“Cooling is critical to enable the performance needed to realize the full promise of AI – today and in the future. Traditional bulky and noisy thermal solutions,like fans, simply don’t meet the challenge. We are thrilled to have the support of our investors to scale our AirJet solutions which make devices faster, thinner, lighter, silent, dustproof and vibration free. AirJet is the ideal thermal solution for products adopting the latest AI capabilities.”
– Dr. Seshu Madhavapeddy, founder and CEO of Frore Systems
