HyperLight announced the closing of an $80 million Series C financing round. The round was led by MediaTek and included participation from UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN Capital, Qatar Investment Authority, and strategic investors from silicon IC and networking companies. Existing investors Summit Partners, The Engine, Foothill Ventures, and Xora Innovation also continued supporting the company.
HyperLight is a thin-film lithium niobate photonics company developing high-performance optical interconnect technology for AI infrastructure, data centers, telecom networks, and emerging photonics markets.
The financing brings together participants across the AI infrastructure value chain, including silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure investment. HyperLight said the round reflects broad ecosystem support for scaling TFLN photonics into production.
HyperLight’s TFLN Chiplet Platform is designed to support short-reach IMDD-based data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics within a single high-volume manufacturable architecture.
The platform supports 200G-per-lane operation, with 400G-per-lane solutions now sampling. HyperLight said the platform combines ultra-high modulation bandwidth, CMOS-level drive voltage, and ultra-low optical loss to help reduce power consumption as AI networks move toward higher lane speeds.
The company plans to use the funding to expand manufacturing capacity, accelerate customer qualification, scale its TFLN Chiplet Platform, and deepen partnerships across foundry, semiconductor, networking, and systems integration domains.
The financing follows HyperLight’s recently announced strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production of the TFLN Chiplet Platform on both 6-inch and 8-inch wafers.
HyperLight said its platform approach is designed to consolidate diverse customer requirements into a standardized production-ready architecture. This is expected to reduce ecosystem complexity, lower manufacturing risk, and support cost-competitive adoption of TFLN photonics at a global scale.
KEY QUOTES:
“This financing is about more than capital — it is about ecosystem alignment. AI infrastructure requires optical interconnects that can deliver higher bandwidth, lower power, and manufacturing scale across pluggable optics and co-packaged optics. HyperLight has spent years building the TFLN technology, manufacturing foundation, and ecosystem relationships required to support that transition. This round accelerates our ability to scale with customers and partners globally.”
Mian Zhang, CEO of HyperLight
“Next-generation AI infrastructure requires optical connectivity that enables 3.2T and beyond. TFLN’s combination of bandwidth and efficiency makes it a compelling technology for high-speed interconnects, and HyperLight is well positioned to support this transition.”
Brian Hsu, Managing Director of MediaTek Innovation Fund
