IBM and the University of Dayton have unveiled a new research and development collaboration focused on next-generation semiconductor technologies, marking a significant expansion of their existing partnership and a major investment in the future of United States chip innovation.
The agreement includes more than $10 million in state-of-the-art semiconductor equipment provided by IBM to support a new nanofabrication facility on the University of Dayton campus. The facility is scheduled to open in early 2027 and is expected to play a central role in semiconductor R&D, hands-on education, and workforce development tied to the AI era.
The collaboration will target several advanced technology areas, including AI hardware, photonics, and advanced packaging. A University of Dayton faculty member and IBM Technical Leader will jointly guide research initiatives, enabling students and researchers to collaborate directly with industry experts on cutting-edge semiconductor challenges.
The new facility aims to provide a lab-to-fab learning environment that prepares students to contribute to the modern semiconductor workforce. The initiative expands on the longstanding relationship between IBM and the University of Dayton, including their work together in the university’s Digital Transformation Center and their involvement in the AI Alliance launched in 2023.
Located in Dayton, Ohio, a region with deep historical ties to aviation and home to Wright-Patterson Air Force Base, the collaboration is expected to strengthen the area’s technology ecosystem. Leaders from the region anticipate that the partnership will attract more businesses, bolster advanced manufacturing capabilities, and enhance the region’s national profile in semiconductor innovation.
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“This is an important moment for the University of Dayton. Deepening our relationship with IBM with this research collaboration will help position UD as a leader in semiconductor and emerging technology research and enable our faculty and students to conduct groundbreaking work. I’m grateful to IBM for their state-of-the-art equipment contributions estimated at over $10M which will position us to educate the next generation of talented engineers trained for the modern economy.”
Eric F. Spina, President, University of Dayton
“This collaboration continues IBM’s tradition of bringing together industry and academia to fuel innovation. Students and researchers at the University of Dayton will have exciting opportunities to contribute to the next wave of chip and hardware breakthroughs that are essential for the AI era.”
James Kavanaugh, Senior Vice President and Chief Financial Officer, IBM
“This relationship between the University of Dayton and IBM promises to be a game-changer for the Dayton region, particularly in the crucial area of semiconductor workforce development. It’s also an example of the collaboration that defines the Dayton spirit. Looking to the future, we’re excited about the possibilities and positive effects on our community including boosting our tech ecosystem, attracting more businesses, and cementing the Dayton region’s reputation as a premier hub for advanced manufacturing and technology.”
Jeff Hoagland, President and CEO, Dayton Development Coalition
