Intel announced that Seok-Hee Lee has been appointed Executive Vice President of Intel Foundry. Lee will report directly to Intel CEO Lip-Bu Tan. In this role, he will lead advanced packaging, system integration, back-end technology development, and back-end manufacturing.
Intel said the appointment is part of the continued evolution of its foundry strategy and reflects the company’s move to establish advanced packaging as a focused business with dedicated leadership.
The company said advanced packaging is becoming increasingly important for performance, power efficiency, and heterogeneous integration across AI systems.
Lee joins Intel from SK On, where he served as President and CEO. He previously served as President and CEO of SK hynix and has also held engineering leadership roles at Intel and in academia.
Intel said Lee brings deep experience in advanced process technologies, large-scale manufacturing, and leading complex technology organizations.
With the leadership change, Naga Chandrasekaran, Executive Vice President of Intel Foundry, will continue reporting to Tan and will lead front-end technology development and front-end manufacturing.
Chandrasekaran will focus on accelerating the ramp of Intel 18A, Intel 14A, and future technologies. He will also continue to oversee design enablement and end-to-end customer-facing and business enablement functions that support Intel Foundry’s growth.
Intel said the new operating model is designed to strengthen its technology development and manufacturing engine while giving customers and partners greater confidence in the company’s ability to deliver with speed, consistency, and predictability.
Intel also announced that Executive Vice President Navid Shahriari will retire after a 37-year career at the company.
KEY QUOTES:
“Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems. Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution. Seok-Hee’s insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems for Intel Foundry customers. He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T and HBI, to high volume for customers and partners.”
Lip-Bu Tan, CEO of Intel
“Intel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing. I’m excited to return home and to join the Intel team as we help advance the company’s technology leadership, manufacturing capabilities, and customer commitments in this critical area.”
Seok-Hee Lee, Executive Vice President of Intel Foundry
