Intel (INTC) Spending $7 Billion For New Chip Packaging Facility In Malaysia

By Annie Baker • Dec 14, 2021
  • Intel Corporation (NASDAQ: INTC) is planning to spend $7 billion on a new chip packaging facility in Malaysia. These are the details.

Intel Corporation (NASDAQ: INTC) is planning to spend $7 billion on a new chip packaging facility in Malaysia, according to Malaysia’s main investment promotion agency in a press invitation via Bloomberg’s sources. This investment is intended to address the global semiconductor shortages.

Specifically, Intel will be investing 30 billion ringgit to enhance its advanced chip packaging capabilities in the island state of Penang. Intel will be elaborating on its plans in Malaysia during a press briefing tomorrow. Trade Minister Azmin Ali and Malaysian Investment Development Authority Chief Executive Officer Arham Abdul Rahman will also participate in the announcement.

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