LQDX: Advanced Semiconductor Manufacturing Materials Company Raises $10 Million

By Amit Chowdhry ● Apr 16, 2024

Averatek, a developer of high-performance materials for advanced semiconductor manufacturing, announced that it has relaunched as LQDX (‘lik-WID-ix) to focus on the rapid adoption of its AI-enabling chemistries and process technologies. The company also concluded a combined equity and initial government funding round of $10 million to fund this next growth stage.

Launched in collaboration with the Stanford Research Institute (SRI), LQDX is based in Silicon Valley and has developed a suite of chemistries and process technologies to transform chip interconnect architecture.

LQDX also made substantive changes to its corporate governance and executive staff, naming Simon McElrea as Director and CEO, Rozalia Beica as Chief Commercial Officer, and Scott Meikle as Executive Chairman.

Simon McElrea joined LQDX after having built and sold several technology businesses, most recently FreePower (a wireless charging innovator adopted by Tesla) and Semblant (a nanomaterials provider adopted by Apple). Rozalia Beica joins from AT&S, where she served as CSO and VP Strategic Marketing & Business Development, having previously held various Executive and C-Level positions at Dupont, Applied Materials, and Yole Developpement. Scott Meikle, PhD was previously SVP of Customer Operations at Lam Research and President of Inotera Memories (now Micron).

KEY QUOTES:

“We are thrilled to relaunch as LQDX. This is a pivotal moment for us and the entire semiconductor industry as we ready ourselves for the unprecedented inflection of AI and High-Performance Computing. The refocus enables us to build our team and support systems for the next phase of growth as an advanced chemical and process licensing business.”

– Simon McElrea, CEO

“There has never been a time like this in the semiconductor industry. LQDX has reengineered every element of the company to prepare ourselves and our partners for the unprecedented ramp in advanced interconnect technology and chiplet-driven architecture.”

– Scott Meikle, Chairman

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