Molex announced the completion of its acquisition of Teramount, an Israel-based developer of detachable fiber-to-chip connectivity technologies designed for co-packaged optics and silicon photonics applications. Financial terms of the transaction were not disclosed.
According to Molex, the acquisition strengthens its optical interconnect portfolio by adding Teramount’s detachable wafer-level fiber-to-chip connectivity technology optimized for high-volume co-packaged optics deployments.
Teramount develops passive detachable coupling technologies designed to support large assembly tolerances and semiconductor-grade wafer-level manufacturing processes used in advanced optical networking systems.
The technology is intended to address scaling and manufacturing challenges associated with co-packaged optics architectures increasingly used in AI infrastructure and hyperscale data center environments.
Following the acquisition, Teramount will continue operating as a design and engineering hub in Jerusalem and will become part of the Optical Connectivity segment within Molex’s Optical Solutions Business.
Molex said the acquisition supports its strategy of expanding optical connectivity and silicon photonics capabilities required for next-generation AI clusters and cloud infrastructure deployments.
The Molex Optical Solutions Business provides optical connectivity, optoelectronic components, and wavelength management technologies across cloud computing, telecommunications, and AI infrastructure markets.
Molex operates globally across more than 40 countries and serves industries including data center, telecommunications, aerospace, transportation, industrial automation, healthcare, and consumer electronics.
KEY QUOTE:
“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor-grade wafer-level processes, filling a critical gap in the optical stack. By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”
Aldo Lopez, President, Datacom Solutions, Molex
