Multibeam has successfully raised $31 million in Series B funding from global investors, led by Onto Innovation and Lam Capital, the venture capital arm of Lam Research. Other contributors include UMC Capital and MediaTek Capital, as well as several financial and corporate investors.
Multibeam’s platform features a production-grade tool with a full-wafer field of view, exceptional depth of focus, maskless writing, and the ability to create unique patterns. These capabilities will open new opportunities in chip design for quantum computing, photonics, and other advanced technologies.
This funding marks a critical growth phase for Multibeam, which has seen increased interest from semiconductor manufacturers since shipping its first EBL production system last year. With its innovative technology and strong partnerships, Multibeam is well-positioned to meet the growing demand in the semiconductor industry.
How the funding will be used: The funds will accelerate the development of Multibeam’s next-generation multi-column Electron Beam Lithography (EBL) platform for 300mm wafers and panel-level maskless lithography. This investment will also support applications that address the demands for lower energy consumption and higher performance in artificial intelligence (AI) and related technologies.
KEY QUOTES:
“We are excited to welcome our new investors. In addition to funding, they bring experience, insight and wisdom acquired from decades of developing breakthrough technologies that advanced the global semiconductor industry. We are grateful for their confidence in our business, product and market strategies, and we value their contribution to our next phase of growth.”
Multibeam Founder and Chairman, Dr. David K. Lam (not affiliated with Lam Capital or Lam Research)
“For the last decade, advances in packaging have ushered in new eras for semiconductors. First, the adoption of copper pillar and fan-out packaging helped power the mobile era and now chiplet architectures are powering the AI era. Future innovation lies in advanced packaging solutions. For packaging with interconnects below 1µm, we see enormous potential for Multibeam’s direct-write lithography technology to enable denser interconnects between chips cost-effectively. Multibeam has taken a novel lithography technology from concept to mass production to address the growing need for advanced integration of chips on large substrates. As such, we are very pleased to lead this Series B investment round.”
Onto Innovation CEO Michael Plisinski
“Heterogenous chip-to-chip integration is essential for delivering the lower power, higher performance semiconductors needed to meet the rapidly escalating demands of AI compute. Multibeam, with its disruptive, innovative miniaturized design, has developed an e-beam lithography system that has the potential to deliver unparalleled patterning flexibility for emerging chiplet applications at the wafer scale and beyond.”
Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging, Lam Research; President, Lam Capital
“Multibeam has developed a highly flexible lithography tool capable of patterning fine features across full wafers. This new type of direct-wafer writing system with high resolution, large depth of focus, and wafer-scale field of view, opens the aperture on the type of chips that can be made.”
UMC Capital President, Kris Peng
“Multibeam’s system enables rapid time to prototype and time to market. These new capabilities enable agile development of a wide variety of novel and diverse applications.”
MediaTek Capital Partner Brian Hsu
