Nearfield Instruments announced that it has closed a $380 million Series D funding round. The financing values the company at $1.6 billion. Nearfield said the round is the largest deep-tech funding round ever completed in the Netherlands. The round was led by new investor Fidelity Management & Research Company, along with Temasek, Walden Catalyst Ventures, Innovation Industries, M&G Investments, and Invest-NL.
Qatar Investment Authority joined the round as a new investor. Existing investors TNO Ventures and ING also participated.
Nearfield Instruments is a semiconductor technology company focused on advanced 3D metrology and process control.
The company plans to use the funding to accelerate its innovation roadmap, establish worldwide Applications Centers of Excellence, expand production capacity, strengthen its global customer support organization, and deepen collaborative R&D with leading semiconductor manufacturers.
Nearfield’s metrology and inspection systems are designed to support advanced semiconductor manufacturing by delivering accurate, reliable, and high-throughput measurements for process control, yield improvement, and manufacturability.
The company said its technology is becoming increasingly important as AI drives demand for more computing performance, lower energy consumption, and faster movement of data across semiconductor systems.
Nearfield’s solutions support critical measurements for High Numerical Aperture Extreme Ultraviolet, Gate-All-Around, Complementary Field-Effect Transistor architectures, and hybrid-bonded 3D integration.
The company said these capabilities help enable the next generation of AI computing by supporting more scalable, energy-efficient, manufacturable, and reliable semiconductor devices.
Founded in 2016 as a spin-off from TNO and headquartered in Rotterdam, Nearfield Instruments develops advanced 3D metrology and inspection solutions for the semiconductor industry.
The company’s proprietary QUADRA platform enables non-destructive, high-throughput atomic force microscopy with full 3D imaging capabilities, including sidewall measurements of complex structures used in advanced logic, memory, and 3D IC packaging applications.
Nearfield operates in Taiwan, South Korea, Japan, Singapore, the United States, and Belgium, and employs about 450 people globally.
KEY QUOTES:
“This highly successful funding round marks a defining moment in our journey and reflects the growing strategic importance of metrology and inspection in the era of AI-driven semiconductor innovation. We are proud to welcome the continued support of existing investors and the confidence of new global investors who understand both the scale of the opportunity ahead and the critical role Nearfield is positioned to play in the semiconductor ecosystem.”
Dr. Hamed Sadeghian, Co-Founder and Chief Executive Officer of Nearfield Instruments
“With this investment, we have one clear vision: to serve our customers with the highest execution, reliability, and speed while delivering breakthrough metrology and inspection solutions for the next generation of semiconductor devices. Nearfield is no longer an emerging player—we’re building a global technology company that’s here to stay, scale, and lead.”
Dr. Hamed Sadeghian, Co-Founder and Chief Executive Officer of Nearfield Instruments
“As global semiconductor demand accelerates, the ability to manufacture chips with atomic precision becomes a strategic imperative. Nearfield’s innovative metrology platform directly addresses the process control challenges that advanced chipmakers face as they push toward next-generation nodes and 3D integration architectures. We are confident in the company’s technology, market opportunity, and execution roadmap, and we’re pleased to continue to support Nearfield as it scales its solutions to address this critical manufacturing bottleneck.”
Niranjan Sirdeshpande, Head of Catalyst at M&G Investments
“Nearfield Instruments is operating at the intersection of two powerful industry shifts: the rapid scaling of AI and the transition to increasingly complex 3D semiconductor architectures. As the semiconductor industry enters a critical new phase, advanced metrology and inspection will become essential enablers of the next generation of chip innovation. We are excited to continue supporting the company’s growth.”
Young Sohn, Founding Managing Partner at Walden Catalyst Ventures
