NextFlex – which is America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute – recently announced $6.49 million in funding (including $3.29 million in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
These awarded projects represent a diverse and innovative set of companies and universities that are collaboratively focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. And Project Call 8.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of FHE devices into applications that require superior performance and assured reliability.
Several projects selected address critical issues in domestic advanced semiconductor packaging capabilities, which directly aligns with technical areas of interest outlined in the CHIPS Program. And Project Call 8.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include the maturation of processes using biodegradable and recyclable substrates, low temperature cure water-based inks, and electronics recycled / reworked for reduced E-waste production.
This latest funding round brings the total amount invested in FHE developments to more than $134 million, including cost-share contributions from Project Call participants.
Project Call 8.0’s funding awards will go to:
— Lockheed Martin and Binghamton University for advancing high-resolution copper printing for RF antenna and multi-layer balun structures.
— Two projects led by Boeing for maturing additive die packaging for cryogenic and high temperature operations and develop sustainable additive printing and production of hybrid integrated receiver electronics and sensors.
— GE Research and Binghamton University to develop and demonstrate the reliability of additively packaged microelectromechanical systems inertia measurements units for harsh environments.
— Auburn University for leading two projects focused on further maturing and demonstrating in-mold flexible electronics reliability for harsh automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
— Iowa State University for validation and technology maturation of real-time process monitoring and control for aerosol jet-printed electronics.
KEY QUOTE:
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas. These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes.”
— Scott M. Miller, PhD, NextFlex Director of Technology
