onsemi has introduced its Embedded Power Platform, a new semiconductor architecture designed to provide substantially higher power density for AI data centers, electric vehicles and industrial automation.
The platform uses the silicon wafer itself as part of the package, allowing multiple semiconductor technologies and components to be integrated into a single architecture.
onsemi said the approach can deliver approximately three to five times higher power density than current solutions, depending on the application.
EPP can integrate silicon, silicon carbide and gallium nitride technologies along with components including FETs, drivers and controllers.
Rather than separately designing electrical, thermal and mechanical systems, engineers can co-design and optimize those elements together from the beginning of the development process.
The company said the approach can shorten development cycles to as little as four months while improving thermal performance, lowering parasitic inductance and enabling higher switching frequencies.
For AI infrastructure, an early EPP-based solid-state circuit breaker was approximately 50% smaller and operated about 20% cooler than existing designs.
Electric vehicle traction inverter applications could achieve up to four times higher power density and approximately 15% lower power losses, according to onsemi.
Subaru is among the first companies evaluating the platform for future electric vehicle architectures and will receive access to engineering samples, simulation models and technical expertise.
The platform is expected to begin sampling with strategic automotive and AI customers and ecosystem participants in 2026.
KEY QUOTES:
“For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture.”
“This approach can redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation.”
Hassane El-Khoury, President and CEO of onsemi
