Qnity Electronics has launched two new thermal interface materials designed to help engineers manage rising heat levels across artificial intelligence systems, advanced computing, automotive electronics and other high-power applications.
The new products are the Laird Tflex CR910 liquid gap filler and Laird Tgrease 3000 thermal grease.
Thermal interface materials are placed between heat-generating components and cooling hardware to improve heat transfer. They fill microscopic gaps and surface irregularities that can otherwise trap air and reduce cooling efficiency.
Effective thermal management has become increasingly important as processors, power electronics and other components deliver greater performance within smaller and more complex systems. Higher power density can generate additional heat, potentially reducing reliability, shortening product life, or limiting performance if not managed effectively.
Qnity said the products were developed to help engineers balance thermal performance, manufacturability, mechanical stress and long-term reliability under demanding operating conditions.
Laird Tflex CR910 is a two-part, dispensable liquid gap filler designed for assemblies containing large or uneven spaces between components and cooling surfaces.
The material provides thermal conductivity of 9.2 watts per meter-kelvin and is designed to maintain low thermal resistance while remaining soft and compliant.
Thermal conductivity measures how effectively a material transfers heat. A higher figure generally indicates that heat can move more efficiently from an electronic component toward a heat sink or other cooling structure.
The soft material profile allows Tflex CR910 to conform to irregular surfaces and varying gap sizes. This can help engineers manage manufacturing tolerances without applying excessive mechanical pressure to sensitive components.
The material is also designed to withstand mechanical stresses while maintaining its thermal performance over time.
Qnity’s second product, Laird Tgrease 3000, is a non-silicone thermal grease developed for high-temperature applications.
The material is certified for operating temperatures up to 200 degrees Celsius and has a thermal conductivity of 3.2 watts per meter-kelvin.
Tgrease 3000 is designed for use across thin bondlines, where only a small amount of material separates a semiconductor device from its cooling surface.
The product was developed specifically for silicon carbide and gallium nitride devices that operate at increasingly high temperatures.
Silicon carbide and gallium nitride are wide-bandgap semiconductor materials used in applications requiring higher efficiency, switching speeds and temperature tolerance than many conventional silicon components.
These materials are increasingly used in electric vehicles, charging infrastructure, renewable energy systems, industrial equipment, data centers and advanced power supplies.
Although silicon carbide and gallium nitride components can operate under demanding conditions, their higher power density imposes thermal management requirements that can affect surrounding materials and the overall system design.
Qnity said Tgrease 3000 combines low thermal resistance with extremely low pump-out characteristics.
Pump-out occurs when repeated heating, cooling and mechanical movement gradually push thermal grease away from the interface it is intended to protect. This can create gaps, reduce heat transfer and contribute to higher component temperatures.
By limiting pump-out, Qnity aims to help customers maintain stable thermal performance, improve device reliability and extend product life.
The company is positioning the two materials as part of a broader thermal management portfolio supporting customers throughout the semiconductor value chain.
Qnity works with customers through its materials science and application engineering capabilities to develop products that address current system requirements while supporting future technology roadmaps.
The company provides technologies used in semiconductor manufacturing, high-speed data transmission and complex electronic systems. Its target markets include AI, high-performance computing, advanced connectivity and automotive electronics.
The launch reflects growing demand for materials that support processors and power devices operating at higher temperatures and power levels.
As AI infrastructure expands, data center operators and equipment manufacturers are placing greater emphasis on cooling efficiency. Thermal limitations can restrict processor performance, increase electricity consumption, and require more expensive cooling systems.
Automotive electrification is creating similar challenges. Electric vehicle power electronics must operate reliably despite temperature changes, vibration and limited installation space.
Qnity said the new products are intended to help engineers address these constraints while improving the manufacturability and durability of high-power systems.
KEY QUOTES:
“As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry’s most important engineering challenges.”
“Thermal management is no longer simply about protecting components. It’s about enabling the next generation of innovation. These innovations reflect Qnity’s broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem.”
Chuck Xu, President of Interconnect Solutions at Qnity
