RAAAM Memory Technologies announced that it has raised $17.5 million in an oversubscribed Series A funding round to support the mass production and full qualification of its patented on-chip memory technology, GCRAM. The round was led by NXP Semiconductors and included participation from a leading multinational networking corporation, IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, and existing investors J-Ventures, Silicon Catalyst Ventures, and Serpentine Ventures. The new funding brings the company’s total capital raised to over $24 million, combining equity financing with the EIC Accelerator grant.
The capital will be used to qualify and scale GCRAM across leading process nodes in multiple top-tier semiconductor foundries. RAAAM has demonstrated its technology on silicon and is collaborating closely with NXP as part of this next stage of development.
Founded in 2021, RAAAM develops memory technology designed to address the memory bottleneck faced by advanced semiconductor designs, particularly AI chips. Its GCRAM solution is designed to deliver improved memory density and reduced power consumption compared to conventional SRAM while enabling seamless integration into standard CMOS processes.
The company stated that the combination of strategic and financial investors reflects growing industry demand to solve scaling challenges in advanced chip architectures. The new funding is expected to accelerate customer and foundry engagements, supporting the transition from proven prototypes to high-volume, market-ready deployments.
RAAAM is headquartered in Israel with an R&D center in Switzerland.
KEY QUOTES:
“This oversubscribed funding round with high-profile strategic and financial investors is another sign of confidence in our company and our revolutionary technology. Our solution promises to resolve the memory bottleneck in leading edge AI chips through significant memory density improvement and lower power consumption compared to SRAM.”
Robert Giterman, CEO and Co-Founder, RAAAM
“This funding, and the backing from strategic investors like NXP and a leading networking corporation, is a strong validation of the industry need for our technology. We’re now in a position to accelerate engagements with leading semiconductor companies and foundries, and align closely with our customers’ product roadmaps.”
Eli Leizerovitz, CBO, RAAAM
“We’ve collaborated with RAAAM for several years and have seen first-hand the potential of their on-chip memory technology. Their solution directly addresses one of the most critical challenges in advanced chip design, and we believe it can deliver significant density and power gains across multiple applications.”
Victor Wang, Vice President of Front-End Innovation, NXP Semiconductors
“Strengthening Europe’s leadership in strategic technologies is central to our mission at the EIC Fund. RAAAM’s breakthrough in on-chip memory directly addresses a critical challenge in the semiconductor value chain. We are happy to support their path from proven prototypes to market-ready solutions.”
Svetoslava Georgieva, Chair of the EIC Fund Board
