Samsung Electronics And Broadcom Sign $200+ Billion Strategic Collaboration

Samsung Electronics and Broadcom announced a memorandum of understanding to expand their strategic collaboration in memory and foundry technologies to support next-generation AI infrastructure. The MOU was announced during the AI Summit at The Midway in San Francisco, with the companies expecting the collaboration to be valued at more than $200 billion across memory and foundry over the next five years through 2030.

On the memory side, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of memory solutions, including High Bandwidth Memory, to support Broadcom’s next-generation AI accelerators. In foundry, the collaboration centers on Samsung’s 2-nanometer and below process technologies for Broadcom’s products, including Wireless Broadband Communications solutions, with plans to extend into advanced packaging technologies built on Samsung’s 2-nanometer process, including 2.3D and 2.5D integration, aimed at enabling higher-performance and more power-efficient AI and networking silicon.

Attendees at the announcement included Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, along with senior executives from both companies and representatives of the Korean government.

KEY QUOTES:

“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging. By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”

Young Hyun Jun, Vice Chairman and CEO, Device Solutions Division, Samsung Electronics

“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important. By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”

Charlie Kawwas, President, Semiconductor Solutions Group, Broadcom