Syenta, a next-generation semiconductor company focused on advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National Reconstruction Fund, with participation from Investible, Salus Ventures, Jelix Ventures, and Wollemi Capital. The round brings total funding to more than $36 million and will support commercialization efforts and expansion into the United States.
The company is addressing a growing bottleneck in artificial intelligence infrastructure, where performance is increasingly constrained by how efficiently chips connect and communicate. As AI systems scale, limitations in advanced packaging and interconnect density have become critical challenges, compounded by concentrated manufacturing capacity.
Syenta’s proprietary Localized Electrochemical Manufacturing technology is designed to improve chip-to-chip connectivity by enabling high-density interconnects. Early results show micron-scale connections that increase bandwidth while reducing manufacturing complexity, including 40 percent fewer process steps, without requiring redesigns to existing fabrication infrastructure.
The company’s approach aims to make advanced packaging more scalable and accessible, helping alleviate supply chain constraints while improving system performance and efficiency. The technology has been validated through industry programs and collaborations with semiconductor equipment providers.
As part of its growth strategy, Syenta is establishing a U.S. presence in Arizona to work more closely with semiconductor customers and manufacturing partners. The expansion is intended to strengthen collaboration and support broader efforts to build a more resilient global semiconductor supply chain.
The funding round also brings strategic involvement, with Pat Gelsinger, general partner at Playground Global, joining the company’s board of directors.
KEY QUOTES:
“Today’s advanced packaging approaches have real limits on interconnect density, which constrain the bandwidth between chips. We’re enabling finer-pitch connections within existing manufacturing infrastructure, allowing systems to move more data more efficiently and at a lower cost without requiring entirely new fabrication approaches.”
Jekaterina Viktorova, CEO And Founder, Syenta
“This is a new way of building high-performance systems at unprecedented scale and power, particularly as AI workloads continue to grow. AI’s next scaling challenge isn’t just compute, it’s how chips connect. What’s compelling about Syenta is that the company is tackling a key constraint in advanced packaging and contributing to the expansion of a more resilient global semiconductor ecosystem.”
Pat Gelsinger, General Partner, Playground Global
“Syenta exemplifies the type of globally competitive, high-impact innovation the NRF was created to support. By advancing next-generation packaging technologies, Syenta strengthens Australia’s role in critical supply chains while contributing to global semiconductor resilience.”
Mary Manning, Chief Investment Officer, National Reconstruction Fund
“AI is driving unprecedented demand for heterogeneous, panel-scale systems. These systems, often composed of hundreds of chiplets, require continued innovation in packaging architectures to increase interconnect bandwidth while improving energy efficiency.”
Deepak Kulkarni, Senior Fellow, AMD
