Teledyne MEMS, a founding partner of the MiQro Innovation Collaborative Center (C2MI), is acknowledging a significant new commitment from the Canadian and Quebec governments as part of C2MI’s next-phase expansion, C2MI1.5. The C$656 million investment strengthens Canada’s semiconductor and microelectronics ecosystem and supports the center’s infrastructure growth in advanced packaging and post-processing technologies.
Teledyne MEMS has been a C2MI partner since 2011. Over 14 years of collaboration, the company has created 120 jobs and supported more than 30 customer projects across applications, including inertial sensors, timing devices, optical MEMS, photonics, microbolometers, and BioMEMS. Teledyne views the new strategic investment as a key enabler for accelerating innovation across these fields while expanding capabilities in next-generation imaging and sensor technologies.
The company emphasized that C2MI1.5 will enhance the region’s capacity for advanced post-CMOS processing on both 200mm and 300mm wafers, further strengthening collaboration across academic and industrial partners. Teledyne MEMS said the expanded capabilities will also support the broader resilience and competitiveness of the North American semiconductor supply chain.
Teledyne, headquartered across North America and Europe, is a major provider of digital imaging technologies, instrumentation, aerospace and defense electronics, and engineered systems.
KEY QUOTE:
“This investment in C2MI directly supports our ability to perform advanced post-CMOS processing on 200mm and 300mm wafers. It strengthens our collaboration with academic and industrial partners, enables the development of next-generation imaging sensors and other products, while accelerating innovation in photonics, MEMS, and sensor technologies.”
Sébastien Michel, Vice President and General Manager, Teledyne MEMS
