Teramount, a leader in fiber-to-chip interconnect solutions for AI and data centers, has secured $50 million in funding led by Koch Disruptive Technologies (KDT). Other participants include existing investor Grove Ventures and new partners like AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund, and Wistron.
As AI drives infrastructure growth, efficient data movement is essential. Teramount’s TeraVerse solution features a detachable connector that links optical fibers to silicon photonics chips in Co-Packaged Optics (CPO) systems.
This funding will enable Teramount to expand its team and increase production to meet the growing demand for CPO technology.
KEY QUOTES:
“This investment, which brings together strong financial and strategic investors, representing important parts of the optical connectivity ecosystem, is a testament to the potential of our technology in AI infrastructure and other high-performance applications. We are grateful to our new and existing investors for their support.”
Hesham Taha, CEO and co-founder of Teramount
“Optical interconnects are critical components of the future of AI infrastructure, and Teramount is poised to be a leading supplier of these solutions. We are very impressed with the position Teramount has established in the market and its partnerships with key industry players.”
Isaac Sigron, managing director at KDT Israel, who will join Teramount’s board of directors
