TTM Technologies announced the opening of its new Ultra-High-Density Interconnect printed circuit board manufacturing facility in Syracuse, New York.
The 215,000-square-foot facility is located on TTM’s existing Syracuse campus and is among the first in the U.S. purpose-built for Ultra-HDI PCB and advanced packaging production for aerospace and defense programs.
TTM said the facility represents a major investment in domestic defense electronics manufacturing and supports next-generation radar, missile defense, space, and autonomous systems.
The company said Ultra-HDI PCBs enable increased miniaturization and performance density in advanced electronics. These capabilities are becoming increasingly important for defense systems that require smaller, faster, and more reliable electronics.
TTM said domestic production capacity for these advanced board technologies has been limited, with a significant portion of global manufacturing concentrated in Asia.
The Syracuse project represents a $130 million investment in domestic production, including $30 million from the U.S. Department of War. The facility is expected to support up to 400 new engineering and manufacturing jobs.
With the expansion, TTM’s total workforce in Central New York is expected to reach approximately 1,000 employees.
The facility builds on TTM’s more than 60-year manufacturing presence in Syracuse and its role as a supplier to the aerospace and defense industrial base.
The facility was first announced in November 2023 and later marked by a beam-signing ceremony attended by New York Governor Kathy Hochul in October 2024.
TTM Technologies manufactures advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets. Its products include mission systems, RF components, RF microwave and microelectronic assemblies, PCBs, and substrates.
KEY QUOTES:
“This is more than a facility — it is a statement about where American defense manufacturing is headed. Our defense customers need trusted, domestic, ultra-high-density interconnect production capability that meets the most demanding program requirements in the world. Today, we bring that capability to the United States. This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York, and positions TTM to support the next generation of defense and national security technologies for decades to come.”
Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies
