VEIR Raises $110 Million Series C Co-Led By Matter Venture Partners And Tyche Partners
By Amit Chowdhry ● Oct 10, 2026
VEIR raised an oversubscribed $110 million Series C round to accelerate commercialization of its superconducting power delivery systems for AI data centers. The round was co-led by Matter Venture Partners and Tyche Partners. LG Technology Ventures, Gates Frontier, Sabanci Climate Ventures, and Hui Capital also participated. Existing investors, including Engine Ventures, Galvanize Climate Solutions, Piva Capital, Congruent Ventures, and VXI Capital, returned for the financing.