Cadence Design Systems recently announced that it has acquired Invecas – a leading provider of design engineering, embedded software, and system-level solutions, headquartered in Santa Clara, California. The deal adds a skilled system design engineering team to Cadence, with expertise in providing customers with custom solutions across chip design, product engineering, advanced packaging, and embedded software.
Driving trends like the digital transformation of multiple vertical markets and more system companies building custom silicon continue to drive strong design activity. And with classic Moore’s law slowing down, new “More than Moore” technologies such as advanced 2.5D/3D packaging and chiplets, are driving the path for significant performance and manufacturing efficiencies. These strategic trends, underpinned by advancements in AI, are bringing in a new era of design and spurring a rapidly growing customer need for skilled end-to-end engineering expertise in enabling their custom silicon and system development efforts.
The deal brings a skilled engineering team centered in Hyderabad led by Invecas CEO Dasaradha Gude that has vast experience in driving end-to-end system solutions with deep expertise in advanced nodes, mixed-signal, verification, embedded software, packaging and turnkey custom silicon production. And Invecas built close relationships with key players in the design ecosystem as well as with top foundry and assembly and test partners. Through extensive experience designing chips and taking them to production, Invecas has served hundreds of customers across various verticals, including mobile, networking, hyperscaler and automotive. Along with Cadence’s leading EDA solutions, Invecas will also utilize and augment Cadence’s broad IP portfolio to enable more comprehensive custom product solutions.
The terms of the deal were not disclosed. And the acquisition is expected to be immaterial to Cadence’s total revenue and earnings this year.
KEY QUOTES:
“With complexity and challenges increasing due to the proliferation of AI, 2.5D/3D and chiplet designs, customers need access to experienced teams that can assist with bringing designs from ideation to production. With the acquisition of Invecas, Cadence is able to scale our system design engineering offerings to support customers in critical high-growth verticals who are faced with the need to aggressively increase performance while tackling ever-increasing system-level complexity.”
— Boyd Phelps, senior vice president and general manager, Silicon Solutions Group, Cadence
“Generational trends are accelerating the increases in design complexity and driving a customer need for skilled engineering talent that can assist with system design. We are excited to join the Cadence team and to enhance the solutions available to customers, utilizing our core expertise to accelerate customer silicon and system development efforts.”
— Dasaradha Gude, CEO, Invecas
