xMEMS Labs, the company behind the world’s first piezoelectric MEMS (piezoMEMS) fan-on-a-chip and a global leader in solid-state silicon speakers, announced the closing of a $21 million Series D funding round led by Boardman Bay Capital Management. The round also saw participation from Cloudview Capital, CDIB-TEN Capital, Harbinger Venture Capital, SIG Asia Investments (an affiliate of Susquehanna International Group), and other strategic investors.
The new financing will accelerate global commercialization and mass production of xMEMS’ piezoMEMS-based loudspeakers and micro-cooling chips, two innovations designed to address key performance challenges faced by AI-enabled consumer devices, including thermal management, compact design, and audio performance.
Founded in 2018, xMEMS has created a new semiconductor category through its monolithic piezoMEMS platform. By leveraging thin-film piezoelectric materials, the company has achieved high performance at extremely small scales. Unlike traditional coil motor components, xMEMS’ fully solid-state speakers and micro-coolers deliver improved reliability, smaller form factors, and enhanced performance — critical for the next generation of edge and AI-driven consumer products.
xMEMS’ two flagship product families—Sycamore and µCooling—are at the forefront of this transformation. Sycamore is the world’s thinnest and lightest high-fidelity MEMS loudspeaker, optimized for AI glasses, headphones, and smartwatches. µCooling is the industry’s first chip-scale, solid-state air-moving solution that delivers silent, vibration-free thermal management for compact devices such as AI glasses, smartphones, and SSDs. Together, they represent a new paradigm in the design of AI-native hardware, addressing the demands of increased compute loads and space efficiency.
The company’s growing portfolio includes more than 250 granted patents and several industry recognitions, including Best MEMS Solution and Startup of the Year at Sensors Converge 2025. The Series D investment marks a major milestone in xMEMS’ growth, enabling the company to scale production, expand partnerships with global OEMs, and advance R&D for future piezoMEMS applications in audio and cooling.
KEY QUOTES:
“This fundraise comes at a moment of rapidly accelerating commercial momentum. Leading consumer device makers are all confronting the same challenge: how to deliver the performance AI demands while also achieving size, weight, thermal management, and audio quality goals. Our piezoMEMS platform solves this. With the support of Boardman Bay Capital Management and our investors, we’re expanding manufacturing and fueling the next wave of piezoMEMS innovation.”
Joseph Jiang, CEO and Co-Founder, xMEMS Labs
“xMEMS is at the heart of a significant shift in hardware design driven by AI. Their technology directly addresses key pain points for today’s AI devices – managing heat, conserving space, and delivering crystal-clear audio in increasingly compact and powerful products. We believe piezoMEMS will be a foundational building block for the AI hardware era.”
Will Graves, Chief Investment Officer, Boardman Bay Capital Management
