ZutaCore announced a $100 million Series C funding round as the company accelerates global expansion and advances its waterless, direct-to-chip, two-phase liquid cooling technology for AI and high-performance computing infrastructure.
The funding round included investments from Mitsubishi Electric, Carrier Ventures, Samsung Electronics through Samsung Ventures, and additional investors. The capital will support commercialization efforts, global deployments, product development, and research initiatives focused on next-generation AI data center cooling requirements.
According to the company, demand for its technology is being driven by the rapid growth of AI workloads and increasing power densities inside data centers. ZutaCore said its waterless two-phase cooling platform is designed to support future AI and HPC processors exceeding 4,000 watts while enabling higher compute density and sustained performance.
The company has completed more than 75 deployments across the Americas, Europe, and Asia and continues to work with global partners to address thermal management challenges associated with next-generation semiconductor architectures.
ZutaCore also announced the expansion of its executive leadership team with four strategic hires. Yaniv Reinhold joined as Chief Financial Officer, Sarah Warshavsky Oberman joined as Chief People Officer, Yoni Nir joined as Chief Research and Development Officer, and Sharon Shafran joined as Chief Operating Officer.
The company stated that the leadership additions are intended to support accelerating global growth, strategic partnerships, and large-scale deployments across hyperscalers, AI cloud providers, and enterprise data center operators.
To support future deployments, ZutaCore established a 2MW End-of-Row emulation platform in Israel designed to replicate real-world thermal and facility interactions without requiring production IT equipment. The company said the platform enables performance validation and reduces deployment risks for customers.
ZutaCore also recently introduced its OmniTherm cold plate technology, which enables waterless two-phase cooling for NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs within a single-slot PCIe form factor.
Support: Goldman Sachs served as exclusive placement agent for the Series C financing.
KEY QUOTE:
“$100M of funding reflects strong validation from leading global partners and growing demand for our technology. AI is fundamentally reshaping data center infrastructure, and traditional approaches are no longer sufficient. With our expanding leadership team and continued innovation, we are well positioned to support the next generation of high-performance, sustainable data centers.”
Erez Freibach, Chairman And CEO, ZutaCore
